355-nm-UV-Laserquellen werden immer häufiger bei der Bearbeitung spröder Materialien eingesetzt

Die Laserherstellungstechnologie basiert auf der physikalischen Wechselwirkung zwischen der hohen Energie des Lasers und dem Material, und das Material wird verdampft, abgetragen, modifiziert usw., um den Materialbearbeitungseffekt zu erzielen. Heutzutage hat die Laserbearbeitung schnell in alle Lebensbereiche Einzug gehalten und wird immer noch von der Metallmaterialbearbeitung dominiert, die mehr als 80 % der gesamten Laserbearbeitungsanwendung ausmacht. Da Metalle wie Eisen, Kupfer, Aluminium und entsprechende Legierungen harte Materialien sind, wirken sie gut auf den Laser ein, sodass sie sich gut für die Laserbearbeitung einsetzen lassen. Für einige gängige Metalllaserschneid- und -schweißanwendungen müssen Sie möglicherweise nur die entsprechende optische Leistung kennen, und die Forschungsanforderungen für die Verarbeitung sind nicht sehr streng.

Tatsächlich werden jedoch viele nichtmetallische Materialien im Leben und in der High-End-Fertigung verwendet, wie z. B. weiche Materialien, thermoplastische Materialien, wärmeempfindliche Materialien, keramische Materialien, Halbleitermaterialien und spröde Materialien wie Glas. Sollen diese Materialien per Laser bearbeitet werden, sind die Anforderungen an Strahleigenschaften, Abtragungsgrad und Kontrolle des Materialbruchs sehr streng und oft ist eine Feinstbearbeitung auch auf Mikro-Nano-Ebene erforderlich. Mit herkömmlichen Infrarotlasern ist es oft schwierig, Ergebnisse zu erzielen, und Ultraviolettlaser sind eine sehr geeignete Wahl.

Die Ultraviolett-Lasertechnologie ist vielseitig

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Ultraviolet laser refers to the light whose output beam is in the ultraviolet spectrum and invisible to the naked eye. At present, the common industrial ultraviolet lasers include solid crystal ultraviolet lasers and gas ultraviolet lasers. The ultraviolet laser output can be obtained by frequency doubling the infrared all-solid-state laser, and the wavelength is mostly 355nm. At present, the pulse width has been successfully developed from nanoseconds to picoseconds. The most common gas UV lasers are excimer lasers, which can be mainly used in ophthalmic surgery, chip lithography, etc. In recent years, fiber lasers have gradually developed products in the ultraviolet band, and picosecond ultraviolet fiber lasers are the most representative.

Since ultraviolet lasers lose a lot of heat during frequency doubling conversion, and the cost is still high, it is still difficult to achieve higher power at present. Ultraviolet laser is often regarded as a cold light source, so ultraviolet laser processing is also called cold working, which is very suitable for the processing of brittle materials.

Common Brittle Materials Processing with UV Lasers

Glass is a material that is widely used in life. From water glasses, wine glasses, containers to glass accessories, pattern making on glass is often a difficult problem. Traditional processing often results in high glass damage rates. Ultraviolet lasers are very suitable for glass surfaces. Marking, pattern making, and can achieve ultra-fine production. Ultraviolet laser marking makes up for various shortcomings such as low processing accuracy, difficulty in drawing, damage to workpieces, and environmental pollution in the past. With its unique processing advantages, it has become the new favorite of glass product processing, and is listed as a must-have in various wine glasses, craft gifts and other industries. machining tools.

Ceramic materials are widely used in construction, utensils, decorations, etc., but in fact, ceramics are also used in many electronic products. For example, some mobile phone merchants have launched ceramic back covers, which are widely used in mobile communication, optical communication, and electronic products. Ceramic ferrules, ceramic substrates, ceramic packaging bases, ceramic cover plates for fingerprint identification systems, etc. used. The production of these ceramic components is becoming more and more refined, and UV laser cutting is an ideal choice at present. Ultraviolet laser has very high processing precision for some ceramic sheets, will not cause ceramic fragmentation, and does not require secondary grinding for one-time forming, and will be more used in the future.

Ultraviolet laser wafer cutting: The surface of the sapphire substrate is hard, and it is difficult for the cutter wheel to cut it, and the wear is large, the yield is low, and the cutting line is larger than 30 μm, which not only reduces the use area, but also reduces the output of the product. Driven by the blue-and-white LED industry, the demand for sapphire substrate wafer cutting has increased significantly, which has put forward higher requirements for improving productivity and finished product pass rate. Ultraviolet laser cutting wafers can achieve high-precision cutting, smooth incisions, and greatly improve the yield.

Quartz cutting has always been a difficult problem in the industry. In the traditional processing method, the most commonly used is the "emery stone saw blade", that is, it is processed by the "head-to-head" method. Quartz is very brittle and difficult to process, and the diamond saw blade is the consumable.

Ultraviolet laser has an ultra-high precision of ±0.02mm, which can fully guarantee precise cutting requirements. In the face of quartz cutting, precise control of power can make the cut surface very smooth, and the speed is much faster than manual processing. All parameters can be displayed in full digital, and different parameters can be precisely adjusted by computer, which is more intuitive than accurate, and the difficulty of getting started is much lower than that of manual cutting.

Chillers help UV laser applications

As a cold light source, ultraviolet laser has attracted much attention. It should be said that it is an ideal wavelength band for laser technology in the fields of fine processing and Wiener structure fabrication. However, in the past, the UV laser technology was difficult, the stability was insufficient, the cost was high, and the power was difficult to increase, which limited its application. As ultraviolet lasers break through the power limit and reduce the price, their application volume is rapidly increasing, especially in the past three years. In addition to the common nanosecond ultraviolet, picosecond ultraviolet and ultrafast fiber ultraviolet lasers have come out, and the application scope has been further opened.

Brittle material laser processing cooling equipment

The application of medium and high power ultraviolet lasers has strict requirements on heat dissipation and temperature control accuracy, and needs to be equipped with high-performance cooling equipment. RFH Laser UV laser application has developed chillers from 3 watts to 30 watts, especially for laser fine processing and ultra-fast laser applications, the ultra-fast laser chiller CWUP series (10W/20W/30W) has been launched. CWUP series chillers are suitable for cooling high-power ultraviolet lasers and ultra-fast lasers. The temperature control accuracy can reach ±0.1℃. It supports computer communication connection and realizes remote monitoring. The launch of CWUP series chillers has raised my country's laser chiller technology to the international advanced level, providing a stable and reliable cooling equipment choice for the application of UV laser micromachining.