Die Schneide ist ordentlich, die Anwendung des grünen RFH-Lasers beim Schneiden von Leiterplatten

Leiterplatten, auch als Leiterplatten bekannt, sind in der Industrieelektronik weit verbreitet und eines der Schlüsselelemente zur Realisierung der Verbindung zwischen verschiedenen Komponenten. Es ist weit verbreitet in Unterhaltungselektronik, Kommunikation, Automobilen, Medizin, Militär, Luft- und Raumfahrt und anderen Bereichen.

Da sich Verbraucherprodukte in eine kleinere und raffiniertere Richtung entwickeln, muss die Leiterplatte immer kleiner werden, die aufzunehmenden Komponenten werden immer dichter und die Produktionsanforderungen werden immer höher. Für Hersteller sind die Modernisierung der Verarbeitungstechnologie, die Verbesserung der Schnittgenauigkeit und die Aufrechterhaltung der Wettbewerbsfähigkeit auf dem Markt zur obersten Priorität geworden.

UV-Laser  | grüner Laser  | UV-Laser  | UV-DPSS-Laser  | Nanosekundenlaser  | UV-Laserquelle  | Festkörperlaser

The use of laser for fine cutting of PCB boards has become a must for PCB manufacturers. The industrial-grade green nanosecond solid-state laser developed and designed by RFH can highly match the cutting needs of manufacturers.

Output 532nm green laser, and very small pulse width (<25 ns@100kHz), the heat-affected zone when cutting PCB boards is small, and the edges are clean and tidy; excellent beam quality (M2<1.2), small spot diameter, The resulting small slits can greatly reduce the generation of defective products, and the product consistency is high, which helps to easily achieve large-scale and fine production.

Generally speaking, the laser cutting speed is proportional to the power. The high power output of this RFH 532 green nanosecond laser of 40W brings high cutting speed and fully improves production efficiency.

Although the infrared laser in the 1064nm band is easy to achieve high power, the heat-affected zone is relatively large during processing, and it is mainly used for material cutting that does not require high material cutting accuracy. The 355nm UV laser has little thermal impact and can achieve high-precision machining. It is mainly used for cutting FPC and hard and brittle materials, with small edge chipping and low carbonization, but generally low power and high price.

This industrial-grade 532nm green nanosecond solid-state laser takes into account the advantages of infrared lasers and ultraviolet lasers. The cutting work, and the price is moderate, it is a cost-effective product.

In the field of precision machining, the trend of laser machining replacing traditional machining is becoming more and more intense. Based on this, RFH will continue to rely on market demand to develop laser products with advanced technology, which will be deeply applied to other fields of precision machining to provide support for manufacturers' high-efficiency production.