Applications of RFH 355nm UV Lasers in These Industries

 

With the continuous development and maturity of laser technology, with the advantages of high processing efficiency, energy saving and environmental protection, high flexibility and non-direct contact processing, lasers are widely used in automobile manufacturing, 3C electronics, medical and health, military, aerospace, new energy, and new materials. It has played an active role in promoting the development of other fields.

 

Lasers can be divided into continuous lasers and pulsed lasers according to different working methods. Continuous lasers have stable operation and high thermal effect, and are often used in laser cutting, laser welding, laser thermal surface treatment, etc. Pulsed lasers output laser light in the form of pulses. The main features are high peak power and small thermal effect. They are often used in the field of micromachining.

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Nanosecond UV solid-state lasers are pulsed lasers that generate UV beams with pulse widths ranging from a few nanoseconds to tens of nanoseconds and powers ranging from a few watts to hundreds of watts. With the unique advantages of high single-photon energy, short wavelength, small light plate, high repetition frequency and high material absorption rate of ultraviolet light, the "cold" processing of materials can be realized, especially for ceramics, glass, crystal, etc. with hard and brittle properties. Material and polymer materials such as PI film, carbon fiber, plastic, polyethylene, etc., which are sensitive to thermal effects, have obvious processing advantages.

 

In our daily life, 355nm UV solid-state lasers are widely used in various industries. RFH 355nm UV nanosecond solid-state lasers (5W and 30W) have the characteristics of high processing accuracy, small thermal effect, and good controllability. High-quality laser drilling, laser cutting, laser etching, laser marking, laser engraving, additive manufacturing, surface modification, etc. in the industrial field.

 

 

1. Application in the processing industry of hard and brittle materials

 

Hard and brittle materials mainly refer to materials such as glass, crystal, wafer, silicon wafer, sapphire, ceramics, etc. They are widely used, ranging from daily utensils and decorations to semiconductors, communications, aerospace and other fields. The traditional cutting and drilling process is easy to cause material cracking during processing, or the collapsed edge is large and the edge is irregular, which will damage or cause the quality of the finished product to be uneven, and it is easy to bring dust pollution or sewage. Moreover, it is not easy to achieve high-quality marking on hard and brittle materials, and the process requirements are not high.

 

Lasers have been used for many years in the processing of hard and brittle materials, and nanosecond ultraviolet solid-state lasers are the leader, with sufficient performance and good economy. Ultraviolet laser is very suitable for marking, cutting and drilling on the surface of hard and brittle materials. Its spot diameter is small, and it is easy to obtain very high peak power after focusing. It can easily process hard and brittle materials. The incision is nearly free of chipping, and the hole wall is smooth when drilling.

 

Second, the application in the circuit board industry

 

Circuit boards can be called printed circuit boards or printed circuit boards. The English name is PCB, FPC (flexible circuit board). It has the characteristics of high wiring density, easy maintenance and high reliability. The applications of nanosecond ultraviolet solid-state lasers in the circuit board industry mainly include laser marking (two-dimensional code marking), laser drilling (blind holes and through holes), and laser cutting. Reasons for using UV nanosecond solid-state lasers:

 

1. The circuit board is developing in the direction of miniaturization and densification. The stacking density of components is getting higher and higher, and the space available for marking, drilling or cutting is getting smaller and smaller, and the processing precision is getting higher and higher. Ultraviolet laser The spot is smaller, and it can bring a finer marking effect after focusing. Similarly, when laser cutting and drilling, the effect of ultraviolet laser is better;

 

 

2. In the application of new materials, UV lasers without picking materials are more advantageous, especially in the cutting of FPC flexible circuit boards. The single-photon energy of UV lasers is high, which can easily realize the cutting of PI films and release paper, and the edge Not carbonized, neatly cut.

 

2. Application in the food industry

 

In the food industry, a large number of packaging bags, bottle bodies, bottle caps, etc. made of plastic, paper and other materials need to be applied. In addition, the food safety standards are gradually improved. Therefore, the application of laser in the food industry is mainly laser marking. Alternative to traditional ink jet printing or stickers. If the ultraviolet nanosecond solid-state laser is used, the effect is self-evident. Ultraviolet laser processing belongs to cold processing. When marking heat-sensitive materials such as plastics and paper, it not only has fine lines and clear edges, but also does not burn or carbonize. The visual effect after marking is very good.

 

3. Application in 3C electronics industry

 

3C mainly refers to computer, communication and consumer electronic products. With the improvement of technology, the application of new materials and the promotion of market demand, the current 3C products are developing in the direction of smaller size, thinner, lighter weight and stronger performance. Traditional screen printing, coding, die cutting, stamping and other processes have been unable to meet the above-mentioned production needs. Therefore, 3C electronics manufacturers purchase ultraviolet nanosecond solid-state lasers and integrate laser marking, laser cutting, laser drilling and other processes into automated product lines.

 

Laser marking is mainly used in the marking of product casings and accessories in the 3C electronics industry, whether it is metal mobile phone casings, laptop casings, or plastic casings for Bluetooth headsets, chargers, charging cables, mouse keyboards, etc. to the laser marking figure. When marking with UV nanosecond solid-state laser, the boundary is clear, even complex two-dimensional codes are not too conceited, the recognition rate of scanning code is very high, far beyond what inkjet or dead printing can achieve, and the marking is durable and has strong anti-counterfeiting ability. Non-corrosive, safe and environmentally friendly.

 

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In der 3C-Elektronikindustrie werden Laserschneiden und Laserbohren hauptsächlich zum Schneiden und Bohren von Materialien wie Leiterplatten, Bildschirmen, Rückglas und Saphirlinsen von Kameras verwendet. Diese Materialien haben hohe Absorptionsraten für ultraviolettes und violettes Licht. Nanosekunden-Festkörperlaser haben präzise Abmessungen, klare Umrisse, geringe thermische Effekte und eine hohe Verarbeitungseffizienz während der Verarbeitung, die sich sehr gut für die Anwendungsanforderungen von hoher Integration und hoher Präzision in der 3C-Elektronikindustrie eignen.

 

Gegenwärtig ist die Anwendung von 355-nm-Ultraviolett-Festkörperlasern ausgereift und nicht auf die oben genannten Branchen beschränkt, insbesondere in der Batterie-, Photovoltaik- und anderen Industrien der neuen Energie, die Anwendung von Ultraviolett-Nanosekunden-Festkörperlasern ist auch üblich, einschließlich Das Schneiden von Metallflocken, das Ritzen von Siliziumwafern, das Laserdotieren von Photovoltaikmaterialien und andere Anwendungen haben den breiten Markt für ultraviolette Nanosekunden-Festkörperlaser voll ausgeschöpft und gefördert. RFH wird die Bedürfnisse der Benutzer weiterhin intensiv kultivieren, die Qualität streng kontrollieren und kontinuierlich hochwertige Dual-Drive-Produkte mit zuverlässiger Leistung entwickeln, um Kunden dabei zu helfen, den intelligenten Herstellungsprozess der Kostensenkung, Effizienzsteigerung, Sicherheit und Kontrolle zu realisieren.